B 422 C63800 Stainless Steels to B 422 (2010)

B 422 C63800 - Specification & Application

  • B 422 (2010) - Copper-Aluminum-Silicon-Cobalt Alloy, Copper-Nickel-Silicon-Magnesium Alloy, Copper-Nickel-Silicon Alloy, Copper-Nickel-Aluminum-Magnesium Alloy, and Copper-Nickel-Tin Alloy Sheet and Strip

Copper-Aluminum-Silicon-Cobalt Alloy, Copper-Nickel-Silicon-Magnesium Alloy, Copper-Nickel-Silicon Alloy, Copper-Nickel-Aluminum-Magnesium Alloy, and Copper-Nickel-Tin Alloy Sheet and Strip

Chemical composition(wt.%) of B 422 C63800 grade: to B 422 (2010)

Elements Min.(≥) Max.(≤) Similar Remarks
C - 0.22
Si - 0.40
Mn - 0.75
P - -
S - -
Ni - 0.75
Cr - 12.50
Al - -
Cu - -
Ti - -
Fe - remaining
N - -
Mo - 1.00
W - 1.00
V - 0.22

B 422 C63800 - Detail

Copper-Aluminum-Silicon-Cobalt Alloy, Copper-Nickel-Silicon-Magnesium Alloy, Copper-Nickel-Silicon Alloy, Copper-Nickel-Aluminum-Magnesium Alloy, and Copper-Nickel-Tin Alloy Sheet and Strip

Mechanical properties of grade B 422 C63800 B 422 (2010)

Proof strength
Rp0.2 (MPa)
Tensile strength
Rm (MPa)
Impact energy
KV (J)
Elongation at fracture
A (%)
Reduction in cross section on fracture
Z (%)
As-Heat-Treated Condition Brinell hardness (HBW)
188 (≥) 698 (≥) 12 11 13 Solution and Aging, Annealing, Ausaging, Q+T,etc 142

Physical properties of grade B 422 C63800 B 422 (2010)

Property Density
kg/dm3
Temperature T
°C/F
Specific heat
J / kgK
Thermal conductivity
W/mK
Electric resistance
µΩ·cm
Modulus of elasticity
kN/mm2
Expansion rate
221 (≥) 878 (≥) 21 34 23 Solution and Aging, Annealing, Ausaging, Q+T,etc 222
Temp.
°C/°F
Creep strain limit
(10000h)
(Rp1,0) N/mm2
Creep rupture strength
(10000h)
(Rp1,0) N/mm2
343 714 868
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