T51605 Tool Die Steels

T51605 - Specification & Application

Mold Steel

Chemical composition(wt.%) of T51605 grade:

Elements Min.(≥) Max.(≤) Similar Remarks
C 0.06 0.10
Si 0.10 0.40
Mn 0.20 0.60
P - 0.030
S - 0.030
Cr 2.00 2.50
Mo - -
V - -
W - -
Ni+Cu - 0.75
Ni - 0.35

T51605 - Detail

Mold Steel

Mechanical properties of grade T51605

Proof strength
Rp0.2 (MPa)
Tensile strength
Rm (MPa)
Impact energy
KV (J)
Elongation at fracture
A (%)
Reduction in cross section on fracture
Z (%)
As-Heat-Treated Condition Brinell hardness (HBW)
695 (≥) 935 (≥) 32 14 22 Solution and Aging, Annealing, Ausaging, Q+T,etc 412

Physical properties of grade T51605

Property Density
kg/dm3
Temperature T
°C/F
Specific heat
J / kgK
Thermal conductivity
W/mK
Electric resistance
µΩ·cm
Modulus of elasticity
kN/mm2
Expansion rate
379 (≥) 599 (≥) 14 33 42 Solution and Aging, Annealing, Ausaging, Q+T,etc 411
Temp.
°C/°F
Creep strain limit
(10000h)
(Rp1,0) N/mm2
Creep rupture strength
(10000h)
(Rp1,0) N/mm2
473 866 952

Equivalent Grade

Equivalent Products

We can customize the production of T51605 grade, contact us for the best solution.
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